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Laser Micromachining

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Laser Micromachining

Selective removal of thin layers
Cutting/structuring of substrates
Digital microscopy (Keyence microscope)

Laser engraving and cutting are advanced techniques that enable precise creation of patterns and shapes, even in hard materials such as glass. They allow cutting with widths down to 30 µm and microstructuring of surfaces based on CAD (AutoCAD) project files. Selective removal of thin layers with an accuracy of up to 15 µm is also possible.
Picosecond laser micromachining system Optec SP450TQ, CO₂ laser processing system with the FL400 OPTEC beam delivery module
Excimer laser micromachining system PROMASTER ATL (OPTEC)
Integrated laser system NT 342A-10 (EKSPLA)

The maskless DLIP (Direct Laser Interference Patterning) technique enables the creation of micro- and nanostructures that impart new properties to surfaces, including hydrophobicity, adhesion, conductivity, and optical characteristics. It is used in surface engineering, biomaterials, photonics, and printed electronics.

Picosecond laser micromachining system Optec SP450TQ with DLIP module


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