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Thermal processing

Offer

Thin-film measurements


Rapid thermal processing (RTP)

Substrate annealing using the RTP method at temperatures up to 1200°C

Annealsys AS-One 150

Annealing across a wide temperature range (up to 300°C)

Binder FD53, Binder FD56

Substrate annealing with high uniformity (±0.5°C below 120°C, ±1% above 120°C) and precision within the range up to 250°C

SÜSS HP8 Hot plates

Fabrication of thin material layers by spin coating (e.g., photoresist), with thickness dependent on spin speed.

SÜSS RCD8, Laurell WS-650, POLOS SPIN 150i

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