Project

Production of Graphene Layers on Copper Wires for Electronic Applications – GLC Connect

Project funded by the National Centre for Research and Development under the Smart Growth Operational Programme 2014–2020

Priority Axis IV: Increasing the Scientific and Research Potential
Action 4.1: Research and Development
Sub-action 4.1.2: “Regional Research Agendas”

Project value: PLN 4,023,577.48 (including PLN 78,032.68 in own contribution)
Funding amount: PLN 234,161.83
Project implementation period: 01/08/2019 – 31/07/2022
Principal Investigator: Dr. hab. Alicja Bachmatiuk

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Consortium:

  • Łukasiewicz – PORT Polish Center for Technology Development – Consortium Leader

  • KGHM CUPRUM Ltd. Research and Development Center

  • Advanced Graphene Products Sp. z o.o.

The project comprises industrial research and development work aimed at designing and constructing a system for applying graphene coatings to thin copper wires. The system addresses two major technological challenges in the electronics industry:

  1. Coating copper wires up to 1 mm in diameter with a uniform graphene monolayer, unwound from commercial spools.

  2. Applying graphene coatings to copper conductive paths on final substrates intended for electronic applications.

At the initial stage, a system for high-temperature and low-temperature graphene synthesis will be constructed. Next, the quality of the resulting graphene coatings will be evaluated, followed by equipment adjustments to meet market expectations.

The project will deliver two systems for coating copper wires with graphene, for which the following parameters will be verified and optimized:

  • coating quality

  • coating speed and process efficiency

  • electrical conductivity

  • durability of the coating layers suitable for industrial-scale applications

The target group includes companies producing copper wires and electronic components that incorporate copper wiring, as well as companies seeking to optimize processes currently involving gold. The project aligns with the latest trends in the electronics industry, where miniaturization and cost reduction are becoming essential.

 
 
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