Materials Technology Laboratory

Materials Technology Laboratory is located in a clean room area with a controlled low level of contamination and is equipped with versatile semiconductor processes facilities assembled for supporting universities and companies for research activities in the field of nanotechnology and microelectronics. We will offer multipurpose technologies: coating, structuring, and surface treatment of different materials. The laboratory conducts services in the area of micro-, and nanostructuring technologies of, i.a., semiconductor, ceramic, and polymer materials. The main methods developed at the laboratory are laser micromachining, optical and electron lithography, production of metallic and dielectric layers, and wet and plasma etching. Moreover, the laboratory has full capacity to analyze and validate structures and microcomponents. The laboratory is also equipped with the apparatus for the production of solar cells and printed electronics.

Contact: inquiries@port.lukasiewicz.gov.pl

  • Production of thin layers:
    • Production of dielectric and conductive layers (evaporation, magnetron sputtering, PECVD)
    • Production of polymer layers (spin coating, dip coating)
  • Methods of production patterns:
    • Optical lithography with nanoimprint
    • Electron lithography
    • Laser structuring to change optical / mechanical properties
    • Inkjet printer for conductive path printing
  • Etching:
    • Wet etching of semiconductors, oxides, nitrides
    • Reactive plasma etching of silicon-based materials and complex semiconductors (ICP/RIE)
    • Wet and plasma cleaning
  • Back-end processes:
    • Laser cutting of metals, semiconductors, insulators (glass, ceramics, sapphire)
    • Polishing and thinning of substrates
    • Thermal treatment (heating in an appropriate atmosphere), Rapid Thermal Processing (RTP)
  • Characteristics of structures:
    • Stylus profilometry
    • Optical profilometry
    • Optical and electron microscopy (SEM)
    • Preparation of micro cross-sections with focused ion beam (FIB)
    • Elipsometry
  • Lithography:
    • SÜSS MicroTec Mask Aligner MA8/BA8 with the nanoimprint system
    • Spin coater (SÜSS MicroTec, Laurell)
    • Heating ovens Binder FD 53
  • Plasma etching:
    • SentechPlasma ICP/RIE SI 500
  • Evaporation/sputtering:
    • Moorfield MiniLab 060
    • Evaporation unit MB-EVAP and spin coater built-in MBraun glove box system
    • Prevac
  • Chemical Vapor Deposition:
    • Sentech PECVD SI 500 D
  • Annealing:
    • Rapid Thermal Processor AS-One 150
  • Characterization and analysis:
    • Electron microscope FEI Helios NanoLab 660 with FIB
    • Ellipsometer Sentech SE850 DUV
    • Brucker stylus profilometer
    • Brucker optical profilometer
    • Inspection microscopes: Leica DM 4000, DM 8000 and Keyence VHX-1000
  • Laser micromachining:
    • Micromachining system with picosecond laser
    • Micromachining system with excimer laser
    • Micromachining system with fiber and CO2 laser
    • System with tunable laser EKSPLA NT342A-
  • System for measuring the current-voltage characteristics of photovoltaic cells with a solar radiation simulator

Ongoing projects:

  • Hybrid sessor platformes of integrated photonics systems based on ceramic and polimer materials (HYPHa)

Ended projects:

  • Development of an innovative technology for personalization of polycarbonate forms of state documents – LaserMark