Clean Room laboratory

Clean Room Laboratory is located in an ISO 5 and ISO 6 class room.

The main methods developed and deployed at the laboratory are optical and electron lithography, production of metallic and dielectric layers, and wet and plasma etching. Our ambition is also to develop technology in manufacturing thin films using atomic layer deposition. Moreover, the laboratory has full capacity to analyze and validate structures and microcomponents.

The Clean Room Laboratory is located in rooms with ISO 5 and ISO 6 cleanliness classes according to ISO 14644 standard. We have clean rooms with a total area of > 600 m2. In this type of laboratory, we have constant monitoring of parameters such as temperature and humidity. Periodic cleanliness measurements confirm the cleanliness class. The amount of dust or other micro-particles is kept constantly low. Additionally, the rooms designed for lithography are equipped with special lighting systems that minimize the amount of light that could interfere with the photolithography process.

The main techniques developed and implemented in the laboratory are optical and laser lithography, manufacturing of metallic and dielectric layers, as well as wet and plasma etching. Our ambition is also to develop competence in the production of thin layers by the atomic layer deposition method and the integration of semiconductor materials. The laboratory has full capability for the analysis and validation of structures of microcomponents produced, both through precise microscopy and two profilometers – contact and optical.

The laboratory also includes a department dealing with changes in material properties. There are several types of lasers (including an ultra-precise picosecond laser) that can be used for cutting, engraving, structuring, removing thin layers, and finally – changing the properties of materials on any type of material, traditionally for materials engineering. In addition to lasers, a printer using the deposition of a selected type of ink on the surface is used to create micro-patterns. Thanks to the presence of a glovebox, it is also possible to carry out processes such as heating, spin coating, and spraying of thin layers in an inert atmosphere – nitrogen. Recently, in the CR-Lab, it is also possible to conduct research on, among others, the mobility of carriers in semiconductors using an ultra-precise Hall effect measurement device.


Patterning Methods:

  • Optical lithography with nanoimprint
  • Laser lithography
  • Printing of conductive tracks (diameter from 5 μm, any shapes)

Thin Film Fabrication:

  • Manufacturing of dielectric and conductive layers (sputtering, magnetron sputtering, PECVD)
  • Application of polymer layers (spin coating, dip coating)
  • Atomic Layer Deposition – ALD


  • Wet etching of semiconductors, oxides, nitrides
  • Reactive plasma etching of silicon-based and compound semiconductors (ICP/RIE)
  • Wet and plasma cleaning

Back-end Processes:

  • Thermal processing (annealing in appropriate atmosphere), rapid thermal processing (RTP)
  • Thermal processing (annealing in nitrogen, air, vacuum)

Structural Characterization:

  • Contact profilometry
  • Optical profilometry
  • Optical microscopy with 3D surface examination
  • Ellipsometry


  • Laser cutting of metals, semiconductors, insulators (glass, ceramics, sapphire)
  • Removal of thin layers
  • Material property modification – creating microstructure through laser structuring enabling material property change
  • Laser engraving – rainbow effect, colored, monochromatic on metals, monochromatic on wood, polymers, paper
  • Unique printing – ability to create unique patterns on material surfaces at a repeatability scale of single microns

Semiconductor Characterization:

  • Hall effect measurement, carrier mobility, semiconductor type.


  • SÜSS MicroTecMaskAligner MA8/BA8 with nanoimprint system
  • Heidelberg Instruments mMLA – laser lithography
  • Spincoaters (SÜSS MicroTec, Laurell, SPS)

Vacuum deposition/sputtering:

  • Moorfield MiniLab 060
  • Moorfield MiniLab 080
  • MB-EVAP vacuum evaporator

Plasma etching:

  • SentechPlasma ICP/RIE SI 500

Chemical vapor deposition:

  • Sentech PECVD SI 500 D


  • Rapid thermal processing (RTP AS-One 150)
  • Hot plate in GloveBox (nitrogen atmosphere)
  • Hot plate in Clean Room

Characterization and measurements:

  • Inspection microscopes: Leica DM 4000, DM 8000, Keyence VHX-7000
  • Contact profilometer Bruker
  • Optical profilometer Bruker
  • Sentech SE850 DUV ellipsometer
  • Hall effect measurement apparatus for carrier resistivity and mobility HMS 8407 LakeShore Cryotronics

Laser micromachining:

  • Pico-second laser micromachining system
  • Excimer laser micromachining system
  • Fiber laser and CO2 laser micromachining system
  • Tunable laser system EKSPLA NT342A

Conductive track creation:

  • XTPL Delta Printing System printer

Completed Projects:

Development of an innovative technology for personalizing polycarbonate state document blanks – LaserMark
Hybrid sensor platforms of integrated photonic systems based on ceramic and polymer materials (HYPHa)

General Contact:

Dr. Eng. Krzysztof Czyż
Tech-Lab Laboratory Manager